Huawei Mate X3 is also said to be equipped with Kirin 9000 processor
Huawei is apparently working on a new foldable phone - the Mate X3. Although Huawei has not yet confirmed any official information about this device, there is now more information about the possible Huawei Mate X3.
There are now new hints on the upcoming Huawei Mate X3 on Weibo. Accordingly, the foldable should be powered by a Qualcomm Snapdragon 8 Gen 1 4G. But there could also be a Kirin 9000 4G chip version.
The Kirin 9000 is manufactured in a 5nm process and features an octa-core architecture - 1x Cortex-A77 at 3.13 GHz, 3x Cortex-A77 at 2.54 GHz and 4x Cortex-A55 at 2.05 GHz. The Kirin 9000 features a 24-core Mali-G78, Kirin Gaming+ 3.0. On the other hand, the chipset will offer AI performance with Huawei Da Vinci Architecture 2.0 and 2x Ascend Lite + 1x Ascend Tiny Core.
A phone with model number PAL-AL00 has received MIIT certification in China, which is said to be the Huawei Mate X3. There the phone is powered by a 4G-capable processor, presumably it was the model variant with the 4G chip of the Snapdragon 8 Gen 1.
The Huawei Mate X3 is said to be presented in April.
Swell):
Huawei Central
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